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<rss version="2.0"><channel><title>The Raw Logs — #hardware</title><link>https://therawlogs.com/tag/hardware</link><description>Top takes tagged #hardware.</description><language>en</language><lastBuildDate>Tue, 08 Sep 2026 16:06:36 GMT</lastBuildDate>    <item><title>#hardware — Samsung and ASML Expand Deal for High-NA Chip Manufacturing</title><link>https://therawlogs.com/take/21-1</link><guid>https://therawlogs.com/take/21-1</guid><pubDate>Tue, 08 Sep 2026 14:35:40 GMT</pubDate><description><![CDATA[Samsung and ASML Expand Deal for High-NA Chip Manufacturing: Samsung and ASML expanded their deal to use High-NA machines to print sub-2nm computer chips. Standard machines require multiple printing passes, which slows manufacturing and raises defect rates. [#hardware]]]></description></item>    <item><title>#hardware — AMD Unveils Liquid-Cooled Deskside Rig with 576GB HBM3E Memory</title><link>https://therawlogs.com/take/20-2</link><guid>https://therawlogs.com/take/20-2</guid><pubDate>Mon, 07 Sep 2026 16:25:16 GMT</pubDate><description><![CDATA[AMD Unveils Liquid-Cooled Deskside Rig with 576GB HBM3E Memory: AMD showed Threadripper Halo Station at IFA 2026, combining 96 CPU cores and 576GB of HBM3E memory to run trillion-parameter models locally. Run large models on local liquid-cooled workstations to avoid cloud rental fees. [#hardware]]]></description></item>    <item><title>#hardware — Lattice Semiconductor Deploys FPGA Security on Robots</title><link>https://therawlogs.com/take/19-5</link><guid>https://therawlogs.com/take/19-5</guid><pubDate>Sun, 06 Sep 2026 18:26:55 GMT</pubDate><description><![CDATA[Lattice Semiconductor Deploys FPGA Security on Robots: Lattice added hardware FPGA chips to robot joints to inspect electronic commands and physically cut motor power if commands are unsafe. Put hardware chips on motor joints to block bad commands before machines move. [#hardware]]]></description></item>    <item><title>#hardware — Broadcom's AI chip revenue triples to $11.5 B on a hyperscale custom ASIC pivot.</title><link>https://therawlogs.com/take/18-2</link><guid>https://therawlogs.com/take/18-2</guid><pubDate>Sat, 05 Sep 2026 18:24:58 GMT</pubDate><description><![CDATA[Broadcom's AI chip revenue triples to $11.5 B on a hyperscale custom ASIC pivot.: Broadcom’s AI chip revenue rose to $11.5 B, tripling. Tech giants moved from standard GPUs to custom ASICs. Generic GPUs waste power on unused hardware blocks. Custom chips lower inference costs by 40% and reduce electricity use for high‑volume queries. [#hardware]]]></description></item>    <item><title>#hardware — Chipmakers emulate full software stacks before taping out 2nm chips</title><link>https://therawlogs.com/take/11-5</link><guid>https://therawlogs.com/take/11-5</guid><pubDate>Thu, 27 Aug 2026 20:12:59 GMT</pubDate><description><![CDATA[Chipmakers emulate full software stacks before taping out 2nm chips: Chipmakers are running full software stacks on hardware emulation clusters before manufacturing 2nm AI chips. Fixing a flawed chip mask costs $50M and causes a 12-month delay. Pre-silicon hardware emulation catches design errors before physical fabrication begins. [#hardware]]]></description></item>    <item><title>#hardware — Infineon buys C2i for software-defined AI server power</title><link>https://therawlogs.com/take/10-1</link><guid>https://therawlogs.com/take/10-1</guid><pubDate>Wed, 26 Aug 2026 16:15:43 GMT</pubDate><description><![CDATA[Infineon buys C2i for software-defined AI server power: Infineon acquired C2i Semiconductors to add digital power controllers to AI server chips. Static regulators waste energy during compute spikes. Dynamic digital regulation adjusts voltage in microseconds, cutting power loss and stabilizing high-load server clusters. [#hardware]]]></description></item>    <item><title>#hardware — Apple releases the M6 Mac Mini for desktop use.</title><link>https://therawlogs.com/take/9-2</link><guid>https://therawlogs.com/take/9-2</guid><pubDate>Tue, 25 Aug 2026 16:40:45 GMT</pubDate><description><![CDATA[Apple releases the M6 Mac Mini for desktop use.: Apple launched the M6 Mac mini with 4x faster neural processing for always-on background agents. Instead of running 450-watt desktop rigs or cloud servers, compact unified memory systems run 30B models continuously at just 65 watts of wall power. [#hardware]]]></description></item>    <item><title>#hardware — AMD launches Helios rack-scale system to end single-vendor lock-in.</title><link>https://therawlogs.com/take/7-2</link><guid>https://therawlogs.com/take/7-2</guid><pubDate>Sun, 23 Aug 2026 14:58:19 GMT</pubDate><description><![CDATA[AMD launches Helios rack-scale system to end single-vendor lock-in.: AMD released Helios, with fancy specs. Buying from a single vendor may cost more and take months to ship. Open rack designs can give better performance for the cost. [#hardware]]]></description></item>    <item><title>#hardware — Intel Fab 52 begins volume production with backside power delivery.</title><link>https://therawlogs.com/take/6-1</link><guid>https://therawlogs.com/take/6-1</guid><pubDate>Sat, 22 Aug 2026 16:49:15 GMT</pubDate><description><![CDATA[Intel Fab 52 begins volume production with backside power delivery.: Intel Fab 52 now mass‑produces 18A silicon wafers powered from the back of the chip. Front power wires cause voltage loss & heat, wasting ~20% of power. Back power cuts loss & boosts transistor density ~30%. [#hardware]]]></description></item>    <item><title>#hardware — Chip manufacturing and 2‑nanometer packaging grow to a $265 billion industry in Arizona.</title><link>https://therawlogs.com/take/5-3</link><guid>https://therawlogs.com/take/5-3</guid><pubDate>Fri, 21 Aug 2026 16:29:25 GMT</pubDate><description><![CDATA[Chip manufacturing and 2‑nanometer packaging grow to a $265 billion industry in Arizona.: TSMC expanded its Arizona chip campus to $265 billion, adding a multi‑factory 2‑nanometer chip production line and advanced chip‑packaging facilities. Local packaging facilities can deliver custom AI chips and networking silicon directly within the country. [#hardware]]]></description></item>    <item><title>#hardware — Synthetic DNA Semiconductor Storage</title><link>https://therawlogs.com/take/3-2</link><guid>https://therawlogs.com/take/3-2</guid><pubDate>Thu, 20 Aug 2026 08:00:00 GMT</pubDate><description><![CDATA[Synthetic DNA Semiconductor Storage: Penn State's synthetic DNA project with a semiconductor is fascinating. Synthetic DNA can store over 250 million GB per gram and uses 100 times less energy. Is this the future of data centers? I hope so. Space is not the only area, as Elon Musk says. [#hardware]]]></description></item>    <item><title>#hardware — Silicon Optical Interconnects</title><link>https://therawlogs.com/take/2-1</link><guid>https://therawlogs.com/take/2-1</guid><pubDate>Wed, 19 Aug 2026 08:00:00 GMT</pubDate><description><![CDATA[Silicon Optical Interconnects: Copper wires in chips generate heat and slow data transfer. Caltech made light guides on silicon to carry data with light. This reduces power waste by 70% and speeds chip communication. Hardware limits need new designs. [#hardware]]]></description></item></channel></rss>